HomeElectronics Multiple choice question MCQ online testVLSI online test mcq (part1) VLSI online test mcq (part1) Leave a Comment / Electronics Multiple choice question MCQ online test Spread the love 0% Created on July 23, 2023VLSI VLSI (part1) 1 / 50 The BiCMOS are preferred over CMOS due to . . . . . . . . a. Switching speed is more compared to CMOS b. All of the mentioned c. Sensitivity is less with respect to the load capacitance d. High current drive capability 2 / 50 In nMOS inverter configuration depletion mode device is called as . . . . . . . a. Pull down b. Pull up c. All of the mentioned d. None of the mentioned 3 / 50 What are the advantages of BiCMOS? a. Better noise characteristics b. Higher gain c. All of the mentioned d. High frequency characteristics 4 / 50 Substrate bias voltage is positive for nMOS. a. False b. True 5 / 50 If both the transistors are in saturation, then they act as . . . . . . . . a. Current source b. Buffer c. Divider d. Voltage source 6 / 50 In CMOS inverter, transistor is a switch having . . . . . . . . a. Infinite on resistance b. Infinite off resistance c. Finite off resistance d. Buffer 7 / 50 Speed power product is measured as the product of . . . . . . . . a. Gate switching delay and gate power absorption b. Gate switching delay and gate power dissipation c. Gate switching delay and net gate power d. Gate power dissipation and absorption 8 / 50 In CMOS fabrication, the photoresist layer is exposed to . . . . . . . . a. Ultraviolet light b. Visible light c. Fluorescent d. Infra red light 9 / 50 Which has better I/A? a. CMOS b. nMOS c. Bipolar d. pMOS 10 / 50 The . . . . . . . . is used to reduce the resistivity of poly silicon. a. Doping impurities b. Photo resist c. None of the mentioned d. Etching 11 / 50 The transistors used in BiCMOS are . . . . . . . . a. MOSFET b. BJT c. JFET d. Both BJT and MOSFETs 12 / 50 Substrate doping level should be decreased to avoid the latch-up effect. a. False b. True 13 / 50 Heavily doped polysilicon is deposited using . . . . . . a. Chemical deposition b. Chemical vapour decomposition c. Chemical vapour deposition d. Dry deposition 14 / 50 Surface mobility depends on . . . . . . . . a. Effective drain voltage b. Effective gate voltage c. Effective source voltage d. Channel length 15 / 50 BiCMOS inverter requires high load current sourcing a. False b. True 16 / 50 Ids depends on . . . . . . . a. Vg b. Vds c. Vdd d. Vss 17 / 50 What is the disadvantage of the MOS device? a. Limited voltage sinking b. Unlimited current sinking c. Limited current sourcing d. Limited voltage sourcing 18 / 50 Pass transistors are transistors used as . . . . . . . a. Switches connected in series b. Inverter used in parallel c. Inverters used in series d. Switches connected in parallel 19 / 50 Increasing fan-out . . . . . . . . the propagation delay. a. Increases b. Exponentially decreases c. Decreases d. Does not affect 20 / 50 The MOSFETS are arranged in this configuration to provide . . . . . . . . a. Both zero static power dissipation and high input impedance b. None of the mentioned c. Zero static power dissipation d. High Input impedance 21 / 50 For depletion mode transistor, gate should be connected to . . . . . . . . a. Drain b. Ground c. Positive voltage rail d. Source 22 / 50 What is the condition for non conducting mode? a. Vds lesser than Vgs b. Vgs lesser than Vds c. Vgs = Vds = 0 d. Vgs = Vds = Vs = 0 23 / 50 CMOS technology is used in developing which of the following? a. Microcontrollers b. All of the mentioned c. Digital logic circuits d. Microprocessors 24 / 50 If the gate is given sufficiently large charge, electrons will be attracted to . . . . . . a. Drain region b. Channel region c. Bulk region d. Switch region 25 / 50 Fast gate can be built by keeping . . . . . . . . a. Input capacitance does not affect speed of the gate b. High on resistance c. Low output capacitance d. High output capacitance 26 / 50 In BiCMOS, MOS switches are used to . . . . . . a. Drive output loads b. Drive input loads c. To amplify the input voltage d. To perform logic functions 27 / 50 As die size shrinks, the complexity of making the photomasks . . . . . . . a. Cannot be determined b. Remains the same c. Increases d. Decreases 28 / 50 The current Ids . . . . . . . . as Vds increases. a. Increases b. Remains fairly constant c. Decreases d. Exponentially increases 29 / 50 The n-well collector is formed by . . . . . . . a. Heavily doped n-type diffused layer on p-Substrate b. Lightly doped n-type epitaxial layer on p-Substrate c. Heavily doped n-type epitaxial layer on p-Substrate d. Lightly doped n-type diffused layer on p-Substrate 30 / 50 Interconnection pattern is made on . . . . . . a. Polysilicon layer b. Silicon-di-oxide layer c. Metal layer d. Diffusion layer 31 / 50 If p-transistor is conducting and has small voltage between source and drain, then it is said to work in . .. . . a. Linear region b. Cut-off region c. Non saturation resistive region d. Saturation region 32 / 50 Transconductance gives the relationship between . . . . . . . a. Input current and output voltage b. Output current and input voltage c. Output current and output voltage d. Input current and input voltage 33 / 50 Latch-up is the generation of . . . . . . . a. Low impedance path b. Low resistance path c. High impedance path d. High resistance path 34 / 50 Increasing the transconductance . . . . . . a. Increases input capacitance b. Decreasing input capacitance c. Decrease in output capacitance d. Decreasing area occupied 35 / 50 The isolated active areas are created by technique known as . . . . . . a. Local Oxidation of Silicon b. Etched field-oxide isolation or Local Oxidation of Silicon c. Etched field-oxide isolation d. None of the mentioned 36 / 50 In latch-up condition, parasitic component gives rise to . . . . . . . . conducting path. a. High resistance b. Low resistance c. Low capacitance d. High capacitance 37 / 50 MOS transistor structure is . . . . . . a. Symmetrical b. Non symmetrical c. Pseudo symmetrical d. Semi symmetrical 38 / 50 Switching speed of a MOS device depends on . . . . . . a. Length channel b. Carrier mobility c. All of the mentioned d. Gate voltage above a threshold 39 / 50 Which of the following is true when inputs are controlled by equal amounts of charge? a. Cg(MOS) lesser than Cbase(bipolar) b. Cg(MOS) greater than Cbase(bipolar) c. Cg(MOS) = Cbase(bipolar) d. Cs(MOS) lesser than Cbase(bipolar) 40 / 50 N-well is formed by . . . . . . . . a. Diffusion b. Filtering c. Decomposition d. Dispersion 41 / 50 Positive photo resists are used more than negative photo resists because . . . . . . . . a. Negative photo resists are more sensitive to light, but their photo lithographic resolution is not as high as that of the positive photo resists b. Negative photo resists are less sensitive to light c. Positive photo resists are more sensitive to light, but their photo lithographic resolution is not as high as that of the negative photo resists d. Positive photo resists are less sensitive to light 42 / 50 Which process produces a circuit which is less prone to latch-up effect? a. pMOS b. BiCMOS c. nMOS d. CMOS 43 / 50 Increasing Vsb . . . . . . . . the threshold voltage. a. Exponentially increases b. Decreases c. Increases d. Does not effect 44 / 50 Depletion mode MOSFETs are more commonly used as . . . . . . . . a. Buffers b. Capacitors c. Resistors d. Switches 45 / 50 In nMOS fabrication, etching is done using . . . . . . . . . a. Sodium chloride b. Plasma c. Hydrochloric acid d. Sulphuric acid 46 / 50 What are the advantages of E-beam masks? a. Looser layer b. Complex design c. Small feature size d. Larger feature size 47 / 50 Which is used for the interconnection? a. Oxygen b. Boron c. Aluminium d. Silicon 48 / 50 The dopants are introduced in the active areas of silicon by using which process? a. Either Diffusion or Ion Implantation Process b. Diffusion process c. Chemical Vapour Deposition d. Ion Implantation process 49 / 50 Contact cuts are made in . . . . . . . . . a. Drain b. Source c. Diffusion layer d. Metal layer 50 / 50 Surface mobility depends on . . a. Effective source voltage b. Channel length c. Effective gate voltage d. Effective drain voltage Your score is LinkedIn Facebook VKontakte 0% Restart quiz Exit Anonymous feedback Thank you Send feedback Spread the love
